Enabling the Next Generation of Technology
Amkor is the world's largest provider of outsourced semiconductor packaging and test services โ powering AI, automotive, 5G, and every technology that moves the world forward.
Explore Our Solutions
Pushing the Boundaries of Chiplet Integration
From 2.5D/3D TSV stacking to fan-out panel-level packaging, our advanced technology platforms enable the AI accelerators and HPC chiplets of tomorrow.
Explore Technologies
A Global Footprint. Proven at Scale.
With over 30 manufacturing sites spanning Asia, Europe, and the Americas, Amkor delivers world-class packaging and test services wherever your customers need them.
View Our FacilitiesBy the Numbers
A Global Leader in Semiconductor Services
50+
Years of Innovation
Since 1968 โ a half-century of packaging leadership
30+
Global Facilities
Manufacturing sites across Asia, Europe & the Americas
33,000+
Employees Worldwide
Dedicated engineers and professionals
30B+
Units Shipped / Year
Proven scale your customers depend on
End Markets
Technology for Every Application
From AI data centers to electric vehicles โ Amkor's advanced packaging solutions power the world's most demanding devices across every major market vertical.
Advanced Technology
Pushing the Boundaries of Semiconductor Packaging
Amkor's advanced packaging portfolio spans every performance tier โ from high-volume mainstream to the leading edge of 2.5D/3D integration. Our engineers work alongside your design teams from concept to production.
- 2.5D / 3D TSV โ High-bandwidth die stacking via through-silicon vias for HBM and chiplet integration
- Flip Chip BGA โ High-density organic substrate packages for maximum I/O and thermal performance
- Wafer Level (WLCSP / FOPLP) โ Ultra-compact fan-out and fan-in packages at the wafer level
- System in Package (SiP) โ Heterogeneous integration of multiple dies in a single package
- Copper Pillar / Micro-Bump โ Fine-pitch interconnects for advanced node chiplets
- Package-on-Package (PoP) โ Stacked logic and memory for mobile and IoT
An unrivaled global footprint
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Ready to engineer your next packaging solution?
Our team of semiconductor packaging experts is ready to help you achieve your performance, cost, and time-to-market goals โ from concept to high-volume production.