Amkor Showcases Next-Gen Packaging and U.S. Expansion at ECTC 2026

At ECTC 2026, Amkor Technology highlighted its advanced packaging portfolio and the progress of its Arizona Advanced Packaging and Test facility, reaffirming its commitment to U.S. domestic semiconductor manufacturing. Amkor engineers presented technical papers on chiplet integration, fan-out packaging, and heterogeneous assembly.

The event offered a platform for Amkor to demonstrate its S-Connect™ bridge die interposer, S-SWIFT™ chiplet integration, and SWIFT® fan-out technologies to attendees from across the global semiconductor industry.