Semiconductor Packaging Solutions

The industry's broadest portfolio of packaging technologies for every application and performance requirement.

Explore All Packaging Contact Us

Scroll

Packaging Categories

Choose a packaging family to explore available technologies and specifications.

📦

Laminate

Advanced substrate-based packages including FCBGA, CABGA, and flip-chip solutions.

View Laminate

🔧

Leadframe

Traditional and advanced leadframe packages including QFP, SOIC, and MicroLeadFrame®.

View Leadframe

💾

Memory

Specialized packaging solutions for DRAM, NAND, and emerging memory technologies.

View Memory

📡

MEMS & Sensors

Packaging for microelectromechanical systems and sensor applications.

View MEMS

⚡

Power Discrete

High-power packaging including D2PAK, TO-220, PowerCSP™, and TOLL packages.

View Power

🔗

System in Package

Multi-die integration solutions for complex system-level packaging.

View SiP

🔬

Wafer Level

WLCSP, WLFO, and WL3D solutions for minimal form factor applications.

View Wafer Level

Need help selecting the right package?

Our packaging experts can guide you through technology selection, design, and qualification.

Contact Packaging Engineering