Packaging Solutions
Laminate
Packaging Solutions
Laminate Packaging
High power and high-speed ICs that require enhanced electrical and thermal performance benefit from the higher functional capabilities of Amkor's laminate package technology.
Laminate packages offer superior electrical performance and thermal management for demanding applications in mobile, networking, automotive, and high-performance computing.
Applications
Markets Served
Laminate packages are used across a broad range of end markets that demand high pin count, high bandwidth, and superior thermal performance.
Mobile & Consumer
Application processors, baseband, and power management for smartphones and tablets.
Networking & Compute
ASICs, FPGAs, and processors for data center, cloud, and enterprise networking.
Automotive
ADAS, infotainment, and powertrain ICs requiring AEC-Q100 qualified packages.
Medical & Industrial
Imaging, diagnostics, and precision industrial control applications.
Communications
RF, mixed-signal, and optical networking ICs for 5G infrastructure.
High-Performance Compute
GPU, CPU, and AI accelerators at the leading edge of silicon density.
Package Portfolio
Laminate Package Types
Amkor offers a comprehensive laminate package portfolio ranging from standard BGA to advanced flip-chip configurations.
CABGA / FBGA
Chip Array BGA and Fine-pitch BGA packages deliver high I/O density in a compact, low-profile form factor.
Learn moreDSMBGA
Die-Stacked MicroBGA combines multiple stacked die in a single footprint, ideal for memory-on-logic integrations.
Learn moreFCBGA
Flip Chip BGA delivers the highest electrical and thermal performance for high pin count processors and ASICs.
Learn morefcCSP
Flip Chip Chip Scale Package provides a near-die-size footprint with flip chip interconnect for mobile processors.
Learn moreFlipStack® CSP
Amkor's proprietary FlipStack CSP integrates flip chip and wire bond stacking in a single slim package.
Learn moreInterposer PoP
Package-on-Package with an organic interposer allows high-bandwidth memory stacking over application processors.
Learn morePBGA / TEPBGA
Plastic BGA and Thermally Enhanced PBGA provide a cost-effective, high-volume solution for general-purpose logic.
Learn moreStacked CSP
Wire-bond stacked CSP packages enable high-density memory integrations — NAND, DRAM — in a standard footprint.
Learn moreNeed a laminate packaging solution?
Our engineering team can help you select the optimal laminate package for your performance, thermal, and cost requirements.