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Packaging

Laminate CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack® CSP Interposer PoP PBGA/TEPBGA Stacked CSP Leadframe ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF® LQFP *Micro*LeadFrame® SOIC SSOP/QSOP TQFP TSSOP/MSOP Memory MEMS and Sensors Power D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL System in Package (SiP) Wafer Level WLCSP WLFO/WLCSP+ WLSiP/WL3D

Technology

2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT®

Test Services

Services

Design Services Package Characterization Wafer Bumping

Applications

Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking

Quality

Amkor Overview Mission Company History Leadership Careers Smart Manufacturing (I4.0) Corporate Responsibility News Events Customer Center Investors Memberships and Partnerships Contact Us

China France Germany Japan Korea Malaysia Philippines

Portugal Singapore Taiwan United States Vietnam

Blog Press Releases

Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library

Laminate Leadframe Memory MEMS and Sensors Power System in Package (SiP) Wafer Level

CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack® CSP Interposer PoP PBGA/TEPBGA

Stacked CSP

ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF® LQFP *Micro*LeadFrame® SOIC SSOP/QSOP

TQFP TSSOP/MSOP

D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC

SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL

WLCSP WLFO/WLCSP+ WLSiP/WL3D

2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT®

Design Services Package Characterization Wafer Bumping

Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking

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Events

Conferences, trade shows, and webinars where Amkor experts share the future of semiconductor packaging

Upcoming Events

No upcoming events scheduled.

Past Events

Sep 30, 2026

Kyushu Semiconductor Industry Exhibition

Fukuoka, Japan

Sep 25, 2026

IMAPS Symposium 2026

Encore Boston Harbor

Sep 14, 2026

ISIG Executive Summit Europe

Prague, Czech Republic

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