Amkor Overview Mission Company History Leadership Careers China France Germany Japan Korea Malaysia Philippines Portugal Singapore Taiwan United States Vietnam Smart Manufacturing (I4.0) Corporate Responsibility News Blog Press Releases Events Customer Center Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library Investors Memberships and Partnerships Contact Us

Packaging

Laminate CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack® CSP Interposer PoP PBGA/TEPBGA Stacked CSP Leadframe ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF® LQFP *Micro*LeadFrame® SOIC SSOP/QSOP TQFP TSSOP/MSOP Memory MEMS and Sensors Power D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL System in Package (SiP) Wafer Level WLCSP WLFO/WLCSP+ WLSiP/WL3D

Technology

2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT®

Test Services

Services

Design Services Package Characterization Wafer Bumping

Applications

Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking

Quality

Amkor Overview Mission Company History Leadership Careers Smart Manufacturing (I4.0) Corporate Responsibility News Events Customer Center Investors Memberships and Partnerships Contact Us

China France Germany Japan Korea Malaysia Philippines

Portugal Singapore Taiwan United States Vietnam

Blog Press Releases

Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library

Laminate Leadframe Memory MEMS and Sensors Power System in Package (SiP) Wafer Level

CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack® CSP Interposer PoP PBGA/TEPBGA

Stacked CSP

ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF® LQFP *Micro*LeadFrame® SOIC SSOP/QSOP

TQFP TSSOP/MSOP

D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC

SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL

WLCSP WLFO/WLCSP+ WLSiP/WL3D

2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT®

Design Services Package Characterization Wafer Bumping

Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking

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Board of Directors

Giel Rutten

Director

No biography available.

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Board of Directors

More from Board of Directors

Susan Kim

Doug A. Alexander

Roger Carolin