Advanced Packaging Technologies

Pushing the boundaries of semiconductor packaging with innovative interconnect, integration, and assembly solutions.

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Technology Portfolio

Our comprehensive technology portfolio addresses every performance tier from mainstream to leading-edge.

2.5D / 3D TSV

Through-silicon via technology for high-density 3D integration and HBM.

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3D Stacked Die

Vertical die stacking for increased density and performance.

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AiP / AoP

Antenna-in-Package and Antenna-on-Package for mmWave and RF applications.

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Chip-on-Chip

Direct die-to-die bonding for heterogeneous integration.

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Copper Pillar

Fine-pitch copper pillar bumping for high-I/O flip chip applications.

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Edge Protection™

Proprietary edge protection for improved reliability and yield.

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Flip Chip

Industry-leading flip chip assembly for high-performance computing.

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Interconnect

Advanced interconnect solutions including RDL, TSV, and microbumps.

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Optical Sensors

Packaging technologies for optical and image sensor applications.

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Package-on-Package

Vertical stacking of packaged components for memory-on-logic.

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S-Connect™

Embedded silicon bridge for high-density die-to-die interconnect.

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S-SWIFT™

Chiplet integration platform for heterogeneous compute.

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SWIFT®

Silicon wafer integrated fan-out technology for advanced packaging.

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Accelerate your next design with Amkor technology

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