Amkor
ํšŒ์‚ฌ ์†Œ๊ฐœ
Hover a section to see sub-items

Packaging Solutions

Packaging

Semiconductor Packaging Solutions

The industry's broadest portfolio of packaging technologies for every application and performance requirement.

Scroll

Packaging Categories

Choose a packaging family to explore available technologies and specifications.

Laminate

Advanced substrate-based packages including FCBGA, CABGA, and flip-chip solutions.

View Laminate

Leadframe

Traditional and advanced leadframe packages including QFP, SOIC, and MicroLeadFrameยฎ.

View Leadframe

Memory

Specialized packaging solutions for DRAM, NAND, and emerging memory technologies.

View Memory

MEMS & Sensors

Packaging for microelectromechanical systems and sensor applications.

View MEMS

Power Discrete

High-power packaging including D2PAK, TO-220, PowerCSPโ„ข, and TOLL packages.

View Power

System in Package

Multi-die integration solutions for complex system-level packaging.

View SiP

Wafer Level

WLCSP, WLFO, and WL3D solutions for minimal form factor applications.

View Wafer Level

Need help selecting the right package?

Our packaging experts can guide you through technology selection, design, and qualification.

์ฟ ํ‚ค ์„ค์ •

๋” ๋‚˜์€ ๊ฒฝํ—˜์„ ์œ„ํ•ด ์ฟ ํ‚ค๋ฅผ ์‚ฌ์šฉํ•ฉ๋‹ˆ๋‹ค. ๊ฐœ์ธ์ •๋ณด ์ฒ˜๋ฆฌ๋ฐฉ์นจ.