Packaging Solutions
Packaging
Semiconductor Packaging Solutions
The industry's broadest portfolio of packaging technologies for every application and performance requirement.
Packaging Categories
Choose a packaging family to explore available technologies and specifications.
Laminate
Advanced substrate-based packages including FCBGA, CABGA, and flip-chip solutions.
View LaminateLeadframe
Traditional and advanced leadframe packages including QFP, SOIC, and MicroLeadFrameยฎ.
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Specialized packaging solutions for DRAM, NAND, and emerging memory technologies.
View MemoryPower Discrete
High-power packaging including D2PAK, TO-220, PowerCSPโข, and TOLL packages.
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Our packaging experts can guide you through technology selection, design, and qualification.