Enabling the Next Generation of Technology
Advanced semiconductor packaging and test services powering AI, automotive, 5G, and every technology that moves the world forward.
Why Amkor
Leading Semiconductor Packaging
By the Numbers
A Global Leader in Semiconductor Services
50+
Years of Innovation
Decades of packaging expertise
30+
Global Facilities
Manufacturing sites worldwide
33,000+
Employees Worldwide
Dedicated professionals
30B+
Units Shipped / Year
Trusted at scale
End Markets
Technology for Every Application
From automotive to AI โ our packaging solutions power the world's most advanced devices across every major vertical.
Advanced Technology
Pushing the Boundaries of Semiconductor Packaging
From 2.5D/3D TSV and Flip Chip to System-in-Package and Wafer Level โ Amkor's technology portfolio covers every performance tier your next device demands.
2.5D / 3D TSV โ High-bandwidth die stacking with through-silicon vias
Flip Chip BGA โ High-density interconnect for maximum I/O
Wafer Level (WLCSP) โ Ultra-compact packages from wafer processing
System in Package โ Multiple chiplets in one package
Copper Pillar โ Fine-pitch connections at advanced nodes
Package-on-Package โ Stacked packages for mobile logic + memory
Worldwide Presence
A Truly Global Footprint
With manufacturing excellence spanning Asia, Europe, and the Americas, Amkor delivers world-class packaging services at every node, in every region โ at the scale the world demands.
10+
Countries
30+
Facilities
6
Continents
What's Coming
Upcoming Events
Start Your Next Project
Ready to engineer your next packaging solution?
Our team of semiconductor packaging experts is ready to help you achieve your technical goals โ faster, smarter, and at scale.