Packaging Solutions
Leadframe
Packaging Solutions
Leadframe Packaging
Leadframe packages have long been an industry standard. Amkor offers a broad portfolio of leadframe package types — from the widely used Small Outline Integrated Circuit (SOIC) and Quad Flat Pack (QFP) families to advanced MicroLeadFrame® (MLF) formats — covering both through-hole and surface-mount applications at industry-leading volumes.
With more than five decades of leadframe packaging experience, Amkor supports customers across automotive, consumer, industrial, and communications markets with proven, cost-optimised solutions.
Why Leadframe
Key Advantages
Leadframe packages remain the package of choice for high-volume, cost-sensitive applications that require proven reliability.
Cost-Effective
Lower material and assembly costs make leadframe ideal for high-volume consumer and industrial ICs.
Through-Hole & SMT
Available in both through-hole (DIP, TO) and surface-mount (QFP, SOIC, SSOP) configurations.
Thermal Performance
Exposed-pad variants (ePad) provide excellent thermal dissipation for power-sensitive devices.
Automotive Qualified
AEC-Q100 qualified packages available for ADAS, powertrain, body electronics, and safety systems.
High Volume
Proven processes support billions of units per year across global assembly sites.
Miniaturisation
MicroLeadFrame® (MLF/QFN) provides a near-chip-scale footprint with exposed-pad thermal performance.
Applications
Markets Served
Leadframe packages are deployed across virtually every end market that requires reliable, cost-efficient semiconductor packaging.
Automotive
Engine control units, transmission, ADAS sensors, and body electronics.
Industrial
Motor control, power conversion, PLCs, and precision measurement.
Consumer Electronics
Power management, audio, touch controllers, and small-signal logic.
Communications
Bluetooth, Zigbee, and sub-GHz RF ICs in compact QFN packages.
Lighting & IoT
LED drivers, smart home controllers, and low-power microcontrollers.
Power Management
LDOs, MOSFETs, gate drivers, and DC-DC converters with exposed-pad cooling.
Package Portfolio
Leadframe Package Types
Amkor's leadframe portfolio spans traditional gull-wing and J-lead formats to advanced no-lead and flip-chip configurations.
ePad LQFP / TQFP
Exposed-pad Low/Thin Quad Flat Pack with a central thermal slug for improved heat dissipation in high-power density ICs.
Learn moreePad TSSOP / SOIC / SSOP
Thin Shrink Small Outline and Small Outline packages with exposed thermal pad for power ICs requiring enhanced cooling.
Learn morefcMLF® (Flip Chip MicroLeadFrame)
Combines flip chip interconnect with the MicroLeadFrame® no-lead form factor for ultra-thin, high-performance packages.
Learn moreLQFP
Low-profile Quad Flat Package with gull-wing leads on all four sides — a popular choice for microcontrollers and FPGAs.
Learn moreMicroLeadFrame® (MLF / QFN)
Near chip-scale, no-lead package with exposed thermal pad. Ideal for RF, power management, and mixed-signal ICs.
Learn moreSOIC
Small Outline Integrated Circuit — one of the most widely used SMT packages, available in standard and wide-body formats.
Learn moreSSOP / QSOP
Shrink Small Outline and Quarter Small Outline Packages offer a finer pitch and smaller footprint than standard SOIC.
Learn moreTQFP
Thin Quad Flat Package with a low profile of 1.0 mm — the standard choice for microcontrollers and DSPs.
Learn moreTSSOP / MSOP
Thin Shrink Small Outline and Mini Small Outline Packages deliver a fine-pitch, compact footprint for logic and memory ICs.
Learn moreNeed a leadframe packaging solution?
Our engineering team will help you select the optimal leadframe package for your pin count, thermal, and cost targets.